NVMTS1D5N08H
Features
? Small Footprint (8x8 mm) for Compact Design
? Low RDS(on) to Minimize Conduction Losses
? Low QG and Capacitance to Minimize Driver Losses
? AEC?Q101 Qualified and PPAP Capable
? These Devices are Pb?Free and are RoHS Compliant
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter Symbol Value Unit
Drain?to?Source Voltage VDSS 80 V
Gate?to?Source Voltage VGS ±20 V
Continuous Drain
Current RJC
(Notes 1, 3) Steady
State
TC = 25°C ID 273 A
TC = 100°C 193
Power Dissipation
RJC (Note 1)
TC = 25°C PD 258 W
TC = 100°C 129
Continuous Drain
Current RJA
(Notes 1, 2, 3) Steady
State
TA = 25°C ID 38 A
TA = 100°C 27
Power Dissipation
RJA (Notes 1, 2)
TA = 25°C PD 5.0 W
TA = 100°C 2.5
Pulsed Drain Current TA = 25°C, tp = 10 s IDM 900 A
Operating Junction and Storage Temperature
Range
TJ, Tstg ?55 to
+175
°C
Source Current (Body Diode) IS 215 A
Single Pulse Drain?to?Source Avalanche
Energy (IL(pk) = 24 A)
EAS 1973 mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL 260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
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