Silicon Carbide (SiC)
MOSFET – 22mohm,
1200V, M3, D2PAK-7L
NTBG022N120M3S
Features
? Typ. RDS(on) = 22 m
? Low switching losses (Typ. EON 485 J at 40 A, 800 V)
? 100% Avalanche Tested
? These Devices are RoHS Compliant
Typical Applications
? Solar Inverters
? Electric Vehicle Charging Stations
? Uninterruptible Power Supplies (UPS)
? Energy Storage Systems
? Switch Mode Power Supplies (SMPS)
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter Symbol Value Unit
Drain?to?Source Voltage VDSS 1200 V
Gate?to?Source Voltage VGS ?10/+22 V
Recommended Operation Values
of Gate?to?Source Voltage
TC < 175°C VGSop ?3/+18 V
Continuous Drain
Current (Note 2)
Steady
State
TC = 25°C ID 58 A
Power Dissipation
RJC (Note 2)
PD 234 W
Continuous Drain
Current RJC (Note 2)
Steady
State
TC = 100°C ID 41 A
Power Dissipation
RJC (Notes 1, 2)
PD 117 W
Pulsed Drain Current
(Note 3)
TC = 25°C IDM 159 A
Operating Junction and Storage Temperature
Range
TJ, Tstg ?55 to
+175
°C
Source Current (Body Diode)
TC = 25°C, VGS = ?3 V
IS 53 A
Single Pulse Drain?to?Source Avalanche
Energy (IL(pk) = 23.1 A, L = 1 mH) (Notes 4, 5)
EAS 267 mJ
Maximum Lead Temperature for Soldering
(1/8″ from case for 10 seconds)
TL 245 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface mounted on a FR?4 board using 1 in2 pad of 2 oz copper.
2. The entire application environment impacts the thermal resistance values
shown, they are not constants and are only valid for the particular conditions
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